Applications

LOCTITE® ABLESTIK XE 80100 – Solvent-free epoxy adhesive for substrate attachment and heat sink bonding in electronics.

  • Item Name: LOCTITE ABLESTIK XE 80100
  • Manufacturer: Henkel
  • Product Category: Assembly Adhesive (for substrate attach and heat sink bonding)
  • Technologies: Epoxy (solventless modified epoxy adhesive)
  • Applications: Substrate attach and heat sink bonding, particularly for applications with mismatched coefficients of thermal expansion
  • Color: Off-white
  • Cure Type: Heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 183 days at -25 to -18°C

1. Product Overview

LOCTITE ABLESTIK XE 80100 is a one-component, solvent-free, modified epoxy adhesive with low stress and high flexibility, making it ideal for applications with mismatched coefficients of thermal expansion (CTE). It is the non-conductive version of ECCOBOND CE8500 and operates at temperatures from -45°C to +200°C.

2. Applications

  • Assembly Applications
  • Substrate attachment
  • Heat sink bonding

3. Typical Properties

Uncured Material

Property Value
Viscosity @ 25°C 12 mPa∙s (cP)
Density 1.15 g/cm³
Shelf Life @ -25 to -18°C 183 days

Curing Performance

Cure Schedule Time
120°C 90 min
150°C 60 min
175°C 15 min

Cured Material Properties

Property Value
Hardness (Shore A) 82
Glass Transition Temperature (DMA) 59°C
Glass Transition Temperature (TMA) 45°C
Coefficient of Linear Thermal Expansion 140 x 10⁻⁶ K⁻¹
Young’s Modulus @ 25°C 10 N/mm² (1,450 psi)
Young’s Modulus @ 50°C 3 N/mm² (435 psi)
Young’s Modulus @ 100°C 2 N/mm² (290 psi)

Extractable Ionic Content

Ion Content (ppm)
Chloride (Cl⁻) 200
Sodium (Na⁺) 10
Potassium (K⁺) 10
Ammonia (NH₃⁺) 75

Tensile Lap Shear Strength

Material 25°C 125°C
Al to Al 5.2 N/mm² (754 psi) 0.3 N/mm² (43.5 psi)
PBT to PBT 1.6 N/mm² (232 psi) 0.1 N/mm² (14.5 psi)

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