Item Name: LOCTITE® CB 3626MHF
Manufacturer: Henkel
Technologies: Epoxy
Color: Red gel-like material
Cure Type: Heat cure (≥100°C, typical 90s @ 150°C)
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
LOCTITE® CB 3626MHF is a one-component, heat-cured epoxy adhesive formulated as a red, gel-like material. It is specifically engineered for bonding surface-mount devices (SMDs) to printed circuit boards (PCBs) prior to wave soldering. The product ensures precise dot size and shape control when dispensed by syringe or stencil printing. With strong adhesion, good thermal resistance, and compatibility with both leaded and lead-free soldering, it provides reliable performance in electronic assembly.
Bonding of surface-mount devices (SMDs) to PCBs
Component assembly and NCA (non-conductive adhesive) applications
Small parts bonding in electronic assemblies
Use with syringe dispensing or stencil printing methods in wave soldering processes
| Category | Property | Value |
|---|---|---|
| Uncured | Technology | Epoxy |
| Appearance | Red, gel-like | |
| Components | One component, no mixing required | |
| Specific Gravity (25°C) | 1.4 | |
| Yield Point (25°C, Casson model) | 272 Pa | |
| Cure Method | Heat cure | |
| Recommended Cure | ≥120 sec @ 130°C or 90 sec @ 150°C | |
| Cured | Glass Transition Temperature (Tg) | 138 °C |
| CTE Below Tg (ASTM D696) | 48 µm/m·°C | |
| CTE Above Tg (ASTM D696) | 184 µm/m·°C | |
| Shear Strength (Steel, 30 min @150°C) | 18 N/mm² (2,610 psi) | |
| Environmental Resistance | Hot Strength Retention | Maintains high strength up to 200 °C |
| Resistance to Hot Solder Dip (260°C, 60 sec) | Pass | |
| Resistance to Process Conditions (wave solder, flux exposure) | 100% strength retained | |
| Lead-Free Solder Compatibility | Compatible with water- and alcohol-based fluxes; no component loss |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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