Manufacturer: Henkel
Technologies: Acrylic, Acrylated Urethane
Color: Bone-white to beige translucent paste
Cure Type: Ultraviolet (UV) / Visible light cure
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
LOCTITE® DSP 190024™ (also known as LOCTITE® 190024™ or LOCTITE® 3703™) is a one-component, medium-viscosity, thixotropic acrylated urethane adhesive. It cures rapidly under UV or visible light and is specially designed for bonding rigid and flexible PVC to polycarbonate, with excellent gap-filling capability up to 0.25 mm. The cured adhesive provides a flexible joint that improves load-bearing and shock-absorbing performance. Its formulation ensures strong adhesion to plastics, glass, and most metals while preventing migration after dispensing.
Bonding rigid and flexible PVC to polycarbonate
Gap filling in assemblies (up to 0.25 mm)
Bonding transparent substrates where UV/visible curing is possible
General adhesion to plastics, glass, and metals in high-speed production environments
| Category | Property | Value |
|---|---|---|
| Uncured | Technology | Acrylic (Acrylated urethane) |
| Appearance | Bone-white to beige translucent paste | |
| Components | One component, no mixing required | |
| Viscosity (25°C, Spindle TB, 10 rpm) | 18,000 – 35,000 mPa·s | |
| Specific Gravity (25°C) | 1.12 | |
| Cure Method | UV/visible light | |
| UV Fixture Time (365 nm, 6 mW/cm²) | ≤10 sec | |
| Depth of Cure (30 mW/cm², 365 nm, 60 sec) | Up to 16 mm | |
| Cured | Elongation (ISO 527-3) | 85 % |
| Tensile Strength (ISO 527-3) | 13 N/mm² (1,900 psi) | |
| Tensile Modulus (ISO 527-3) | 490 N/mm² (71,000 psi) | |
| Block Shear Strength – PC to PC | 18 N/mm² (2,600 psi) | |
| Block Shear Strength – PC to PVC | 16 N/mm² (2,300 psi) | |
| Block Shear Strength – PC to Al | 7 N/mm² (1,000 psi) | |
| Environmental Resistance | Heat Aging (49°C / 100% RH, 1 week) | PC-PC: 85%, PC-PVC: 75%, PC-Al: 80% of initial strength |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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