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LOCTITE® EA 9461 – Epoxy Adhesive – Bonding

  • Item Name: LOCTITE® EA 9461 (Hysol 9461)
  • Manufacturer: Henkel
  • Technologies: Epoxy, Two-Component (Resin & Hardener)
  • Color:
    • Resin: White Opaque Paste
    • Hardener: Black Opaque Paste
    • Mixed: Gray Paste
  • Cure Type: Room Temperature Cure, Heat Cure Acceleration Possible
  • Package Size: Contact Techniq VN for details
  • Shelf Life: Contact Techniq VN for details

1. Product Overview

LOCTITE® EA 9461 (formerly known as Hysol 9461) is a two-component epoxy adhesive designed for high-performance bonding. It offers:

  • Excellent peel and shear strength
  • Impact and fatigue resistance
  • Non-sag, thixotropic paste for easy application
  • Medium working life with the option for accelerated heat curing
  • Bonds dissimilar materials, including metals, thermoplastics, and thermoset laminates (e.g., SMC)

2. Applications

  • Structural bonding of metals, plastics, and composites
  • Industrial and manufacturing applications requiring durability and toughness
  • Adhesive

3. Typical Properties

Property Resin Hardener Mixed
Appearance White paste Black paste Gray paste
Viscosity (mPa·s) (Shear rate 10 s⁻¹) 85,980 59,530
Specific Gravity (@ 25°C) 1.35 1.31
Mix Ratio (by volume/weight) 1:1 1:1
Pot Life (@ 22°C, 100g mass) 40 min
Fixture Time (@ 22°C) 240 min

4. Properties After Curing (7 days @ 22°C)

Property Value
Shore Hardness (D) 80
Elongation (%) 3.5
Tensile Strength (N/mm² / psi) 30 / 4,400
Tensile Modulus (N/mm² / psi) 2,757 / 400,000
Dielectric Strength (kV/mm) 36.6
Volume Resistivity (ohm·cm) 1.8 × 10¹⁴

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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