LOCTITE® EA 9492 is a two-component epoxy adhesive with high temperature resistance, excellent solvent resistance, and very low outgassing properties. It is a lower viscosity version of LOCTITE® EA 9491, designed for bonding and repairing various materials while maintaining superior mechanical, electrical, and impact resistance.
| Property | Resin | Hardener | Mixed |
|---|---|---|---|
| Appearance | White opaque paste | Grey opaque liquid | White opaque paste |
| Specific Gravity @ 25°C | 1.51 | 1.52 | – |
| Viscosity (mPa·s) | 50,000 – 120,000 (Brookfield RVT, 25°C) | 20,000 – 50,000 (Brookfield RVT, 25°C) | – |
| Mix Ratio (by weight) | 2:1 | – | – |
| Mix Ratio (by volume) | 100:50 | – | – |
| Pot Life (100g @ 22°C) | – | – | 15 min |
| Fixture Time (@ 22°C) | – | – | 75 min |
| Full Cure Time | – | – | 3 days at room temperature (can be accelerated with heat) |
| Property | Value |
|---|---|
| Shore Hardness (D) | 80 |
| Tensile Strength (N/mm²) | 31 (4,500 psi) |
| Tensile Modulus (N/mm²) | 6,700 (970,000 psi) |
| Compressive Strength (N/mm²) | 80 (12,000 psi) |
| Coefficient of Thermal Expansion (K⁻¹) | 63×10⁻⁶ |
| Thermal Conductivity (W/m·K) | 0.3 |
| Dielectric Breakdown Strength (kV/mm) | 17.5 |
| Dielectric Constant (1 kHz) | 6.1 |
| Dissipation Factor (1 kHz) | 0.09 |
| Substrate | Strength (N/mm²) | Strength (psi) |
|---|---|---|
| Mild Steel (grit blasted) | 20 | 2,900 |
| Aluminum (abraded) | 14 | 2,000 |
| Aluminum (acid etched) | 15 | 2,200 |
| Stainless Steel | 12 | 1,700 |
| Brass | 1 | 150 |
| Galvanized Steel | 2.2 | 320 |
| Zinc Dichromate | 6 | 870 |
| Polycarbonate | 5.3 | 770 |
| ABS | 3 | 440 |
| GRP (Polyester Resin Matrix) | 5 | 730 |
| PVC | 1.9 | 280 |
| Glass Fiber Reinforced Epoxy | 7 | 1,000 |
| Condition | 500h | 1000h | 3000h |
|---|---|---|---|
| Motor Oil | 115% | 115% | 115% |
| Unleaded Gasoline | 115% | 115% | 115% |
| 50% Water Glycol (87°C) | 130% | 110% | 105% |
| 4% Sodium Hydroxide | 125% | 110% | 115% |
| Water (60°C) | 130% | 120% | 120% |
| Acetone | 80% | 70% | 65% |
| Acetic Acid (10%) | 105% | 95% | 95% |
| 7.5% Saltwater | 105% | 100% | 100% |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
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LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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