LOCTITE® EA 9497™ is a two-component, room temperature curing epoxy adhesive with high thermal conductivity and high compressive strength. It is ideal for heat dissipation applications and demanding hot-strength conditions.
| Property | Resin | Hardener |
|---|---|---|
| Specific Gravity @ 25°C | 2.05 – 2.13 | 2.02 – 2.1 |
| Viscosity (Pa⋅s, @ 25°C) | 5 – 16 | 8 – 24 |
| Property | Value |
| Pot Life @ 25°C (267g resin / 133g hardener) | 165 – 255 min |
| Property | Value |
| Coefficient of Thermal Conductivity (W/m-K) | 1.4 |
| Coefficient of Thermal Expansion (K-1) | Below Tg: 50×10⁻⁶, Above Tg: 104×10⁻⁶ |
| Linear Shrinkage (%) | 0.73 |
| Tensile Strength (N/mm², psi) | 52.6 (7,640) |
| Tensile Modulus (N/mm², psi) | 2,420 (351,000) |
| Compressive Strength (N/mm², psi) | 112.5 (16,300) |
| Elongation (%) | 2.9 |
| Shore Hardness (Durometer D) | 83 |
| Glass Transition Temperature (°C) | 67 (Room Temp. Cure), 97 (Cured 24h @ 22°C + 30min @ 80°C), 116 (Cured 24h @ 22°C + 15min @ 120°C) |
| Property | Value |
| Dielectric Constant / Dissipation Factor (IEC 60250) | 1 kHz: 5.5 / 0.038, 1 MHz: 5.0 / 0.001, 10 MHz: 2.5 / 0.983 |
| Volume Resistivity (Ω⋅cm) | 41×10¹⁵ |
| Surface Resistivity (Ω) | 75×10¹⁵ |
| Substrate | Strength (N/mm², psi) |
| Mild Steel (grit blasted) | 20 (2,900) |
| Stainless Steel | 9 (1,300) |
| Aluminum | 7 (1,000) |
| Aluminum (abraded) | 15 (2,170) |
| Brass | 5 (750) |
| Copper | 5 (750) |
| Zinc Dichromate | 5 (750) |
| ABS | 6 (900) |
| Polycarbonate | 4 (700) |
| PMMA | 1 (150) |
| Glass Fiber Reinforced Epoxy | 8 (1,200) |
| Hardwood (Teak) | 12 (1,700) |
| Softwood (Deal) | 8 (1,200) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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