Applications

LOCTITE® ECCOBOND BF 4 – Adhesive/Backfill – Die Attach for Optoelectronic Applications

Item Name: LOCTITE® ECCOBOND BF 4
Manufacturer: Henkel
Technologies: Epoxy
Color: Black liquid
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months

1. Product Overview

LOCTITE® ECCOBOND BF 4 is a black liquid epoxy adhesive designed for die attach and backfill applications in optoelectronic components. It provides strong adhesion to plastics, low outgassing, low moisture absorption, high Tg, and non-conductive properties. It is compatible with AA50 and AA50T adhesives for active alignment.

2. Applications

  • Encapsulation and structural bonding in optoelectronics
  • Die attach applications
  • Backfill for active alignment of opto components

3. Typical Properties

Uncured Material

Property Value
Thixotropic index (0.5/5 rpm) 1.9
Viscosity (Brookfield CP51, 25°C) 23,500 mPa·s (cP) @ 5 rpm
Work life @ 25°C 24 hours
Shelf life @ -40°C 365 days

Curing Performance

Recommended Cure Schedule
30 minutes @ 100°C

Cured Material Properties

Property Value
Coefficient of Thermal Expansion (ppm/°C) 32 (Below Tg), 87 (Above Tg)
Glass Transition Temperature (Tg) 94°C
Extractable Ionic Content (ppm) Cl- <70, Na+ <10, K+ <5
Weight Loss @ 300°C 0.2%

Performance of Cured Material

Property Value
Die Shear Strength @ 25°C (2×2 mm Si die on Ag/Cu LF) 24 kg-f

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