LOCTITE ECCOBOND DP 1005 is a heat-cured epoxy adhesive designed for die attach applications. It offers excellent chemical resistance, jet dispensability, and strong adhesion to tantalum oxide and silicon nitride passivation layers. This adhesive is particularly suited for bonding metal dies to low-energy plastic substrates like LCP/PPS.
| Property | Value |
|---|---|
| Uncured Properties | |
| Viscosity @ 35°C (6,700 s⁻¹) | 500 mPa·s (cP) |
| Pot Life (Rheology) | 24 hours |
| Curing Properties | |
| Recommended Cure Schedule | Ramp from 25°C to 120°C, hold for 60 min @ 120°C |
| Cured Properties | |
| Glass Transition Temperature (DMA) | 75°C |
| Young’s Modulus (DMA) @ 25°C | 3,000 N/mm² (435,000 psi) |
| Ink Uptake (28 days @ 70°C) | < 15% |
| Performance | |
| Die Shear Strength (LCP/PPS to SiN or TaO) | 40 kg-f |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
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