Applications

LOCTITE® ECCOBOND E 3200 – Fast-curing, heat-activated epoxy adhesive for bonding dissimilar engineering substrates.

  • Item Name: LOCTITE ECCOBOND E 3200
  • Manufacturer: Henkel
  • Product Category: Assembly Adhesive
  • Technologies: Epoxy
  • Applications: Bonding dissimilar engineering substrates (e.g., polyimide, polyphenylene oxide, polybutylene terephthalate, polysulfone, silicon, copper, and gold)
  • Color: Light tan
  • Cure Type: Heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 3 months (90 days at -18°C)

1. Product Overview

LOCTITE ECCOBOND E 3200 is a fast-curing, heat-activated epoxy adhesive designed for bonding dissimilar engineering substrates. It is resilient, flexible, and provides excellent chemical and humidity resistance.

2. Applications

  • Ideal for assembly applications.
  • Compatible with substrates such as Polyimide, Polyphenylene oxide, Polybutylene terephthalate, Polysulfone, Silicon, Copper, and Gold.
  • Suitable for bonding dissimilar engineering materials in environments requiring chemical resistance and durability.

3. Typical Properties

Uncured Properties

Property Value
Viscosity (Brookfield, 10 rpm) 150,000 mPa·s (cP)
Sag Resistance 0.5 inches
Specific Gravity 1.15
Shelf Life (@ -18°C) 90 days

Curing Performance

Cure Temperature Cure Time
100°C 20 min
110°C 10 min
120°C 5 min

Cured Properties

Property Value
Hardness (Shore D) 78
Temperature Range of Use -25°C to 100°C

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