LOCTITE ECCOBOND EN 3707F is a light yellow, one-component epoxy encapsulant designed for local circuit board protection. It features dual-cure capability, allowing fast UV curing with a secondary heat cure for shadowed areas. The adhesive offers easy dispensability without stringing and is fluorescent under UV light for inspection purposes.
| Properties | Values |
|---|---|
| Unmixed Properties | |
| Technology | Epoxy |
| Appearance | Light yellow liquid |
| Viscosity (Brookfield CP51, 25°C) | 3,480 mPa·s (cP) @ 20 rpm |
| Pot Life (@ 25°C) | 3 days |
| Shelf Life (@ 2 to 8°C) | 180 days (6 months) |
| Fluorescence | Yes (under UV light) |
| Curing Properties | |
| UV Cure (UVA/UVB) | 100 mW/cm² for >30 seconds |
| Depth of Cure (UV, 100 mW/cm² for 30s) | ≥10 mm |
| Heat Cure Options | 30 min @ 80°C / 5 min @ 100°C / 1-2 min @ 130°C |
| Cured Properties | |
| Glass Transition Temperature (Tg) | 36.8°C |
| Coefficient of Thermal Expansion (TMA) | Below Tg: 50.3 ppm/°C / Above Tg: 162.2 ppm/°C |
| Storage Modulus (DMA @ 25°C) | 4,400 N/mm² (638,000 psi) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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