LOCTITE ECCOBOND EN 3707F is a light yellow, one-component epoxy encapsulant designed for local circuit board protection. It features dual-cure capability, allowing fast UV curing with a secondary heat cure for shadowed areas. The adhesive offers easy dispensability without stringing and is fluorescent under UV light for inspection purposes.
| Properties | Values |
|---|---|
| Unmixed Properties | |
| Technology | Epoxy |
| Appearance | Light yellow liquid |
| Viscosity (Brookfield CP51, 25°C) | 3,480 mPa·s (cP) @ 20 rpm |
| Pot Life (@ 25°C) | 3 days |
| Shelf Life (@ 2 to 8°C) | 180 days (6 months) |
| Fluorescence | Yes (under UV light) |
| Curing Properties | |
| UV Cure (UVA/UVB) | 100 mW/cm² for >30 seconds |
| Depth of Cure (UV, 100 mW/cm² for 30s) | ≥10 mm |
| Heat Cure Options | 30 min @ 80°C / 5 min @ 100°C / 1-2 min @ 130°C |
| Cured Properties | |
| Glass Transition Temperature (Tg) | 36.8°C |
| Coefficient of Thermal Expansion (TMA) | Below Tg: 50.3 ppm/°C / Above Tg: 162.2 ppm/°C |
| Storage Modulus (DMA @ 25°C) | 4,400 N/mm² (638,000 psi) |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.