Item Name: LOCTITE ECCOBOND EN 3838FL
Manufacturer: Henkel
Technologies: Epoxy
Color: Black liquid
Cure Type: Heat cure (>8 min @ 130 °C)
Package Size: Contact to Techniq VN for details.
Shelf Life: 270 days @ -20 °C
LOCTITE ECCOBOND EN 3838FL is a one-component, black epoxy adhesive designed for encapsulation and glob top applications. It is thixotropic, fluorescent, and cures rapidly at moderate heat conditions. The product provides low glass transition temperature (Tg), low modulus, and flexible protection for electronic components. Once cured, it ensures physical stability and reliable performance under temperature, humidity, and bias testing.
Encapsulation for CSP and BGA packages
Glob top protection for components on PCBs
Suitable for assemblies requiring flexibility, low Tg, and stable electronic performance under environmental stress
| Property | Uncured | Cured |
|---|---|---|
| Appearance | Black liquid | Solid adhesive |
| Viscosity (25 °C, 20 rpm) | 5,800 mPa·s | — |
| Thixotropic Index | 5.6 | — |
| Pot Life (25 °C) | 3 days | — |
| Shelf Life (-20 °C) | 270 days | — |
| Cure Condition | >8 min @ 130 °C | — |
| Hardness | — | Shore D 25 |
| Glass Transition Temperature (Tg) | — | 2 °C |
| CTE Below Tg | — | 60 ppm/°C |
| CTE Above Tg | — | 205 ppm/°C |
| Storage Modulus (25 °C) | — | 536 N/mm² (77,700 psi) |
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