• Item Name: LOCTITE® ECCOBOND EN 3838T
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Black liquid
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ECCOBOND EN 3838T is a one-component, black epoxy encapsulant. It is thixotropic, reworkable, and designed for Pb-free applications. The material cures rapidly at moderate heat, forming a low glass transition temperature (Tg), low-modulus structure that provides mechanical protection and stable electronic performance under temperature, humidity, and bias stress conditions.
Encapsulant for protecting PCB components
Optimized for CSP and BGA packages
Suitable where flexibility, reworkability, and low-modulus protection are required
| Property | Still Not Mixed (Uncured) | After Mixed / Cured |
|---|---|---|
| Appearance | Black liquid | Solid encapsulant |
| Viscosity (mPa·s, 25°C, 20 rpm) | 6,700 | — |
| Thixotropic Index (2/20 rpm) | 5.8 | — |
| Specific Gravity | 1.2 | — |
| Pot Life @ 25°C | 3 days | — |
| Shelf Life @ -20°C | 365 days | — |
| Cure Method | Heat cure | — |
| Recommended Cure | 8 min @ 130°C | — |
| Hardness | — | Shore D 27 |
| Glass Transition Temp (°C) | — | 2 |
| CTE (ppm/°C, below Tg) | — | 57 |
| CTE (ppm/°C, above Tg) | — | 217 |
| Storage Modulus @ 25°C | — | 466 N/mm² (67,590 psi) |
| Thermal Conductivity | — | 0.22 W/m·K |
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