Item Name: LOCTITE ECCOBOND EN 3840T
Manufacturer: Henkel
Technologies: Epoxy
Color: Yellow white liquid
Cure Type: Heat cure (>10 min @ 130 °C or >5 min @ 150 °C)
Package Size: Contact to Techniq VN for details.
Shelf Life: 180 days @ -20 °C
LOCTITE ECCOBOND EN 3840T is a one-component, yellow-white epoxy encapsulant engineered for CSP and BGA connector applications. It is halogen-free, highly thixotropic for precise dot shape control, and cures quickly at moderate heat. Once cured, it provides strong adhesion, mechanical strength, and resistance to moisture, ensuring stable electrical performance under temperature and humidity stress conditions.
Encapsulation of CSP and BGA connectors
Protection of electronic components on PCBs
Suitable for assemblies requiring fast cure, dot shape stability, and moisture resistance
| Property | Uncured | Cured |
|---|---|---|
| Appearance | Yellow white liquid | Solid adhesive |
| Viscosity (25 °C) | 9,000 mPa·s | — |
| Thixotropic Index | 4.0 | — |
| Pot Life (25 °C) | 2 days | — |
| Shelf Life (-20 °C) | 180 days | — |
| Cure Condition | >10 min @ 130 °C >5 min @ 150 °C |
— |
| Hardness | — | Shore D 65 |
| Glass Transition Temperature (Tg) | — | 40 °C |
| CTE Below Tg | — | 73 ppm/°C |
| CTE Above Tg | — | 209 ppm/°C |
| Tensile Modulus | — | 1,563 N/mm² (226,694 psi) |
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