Item Name: LOCTITE® ECCOBOND EN 3846
Manufacturer: Henkel
Technologies: Acrylate
Color: Blue liquid
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 6 months
LOCTITE® ECCOBOND EN 3846 is an acrylate-based, blue liquid adhesive specifically formulated as a one-component encapsulant for PCB applications. It is non-conductive, halogen-free, fluorescent, and thixotropic. The product cures rapidly under heat, providing excellent protection, flexibility, and reliable insulation in electronic assemblies.
Encapsulation of electronic components on printed circuit boards.
Suitable for BGA (Ball Grid Array) and CSP (Chip Scale Package) devices.
Ideal where fast heat curing and strong dielectric properties are essential.
| Condition | Property | Value |
|---|---|---|
| Still Not Mixed (Uncured) | Viscosity @ 25°C, shear rate 20 s⁻¹ | 3,200 mPa·s |
| Thixotropic index (2/20 s⁻¹) | 4.7 | |
| Pot life @ 25°C | 48 h | |
| Shelf life @ -20°C | 180 days | |
| Curing Performance | Recommended cure | ≥10 min @ 160°C |
| After Mixed (Cured) | Hardness | Shore A 54 |
| CTE below Tg | 82 ppm/°C | |
| CTE above Tg | 206 ppm/°C | |
| Glass transition temperature (Tg) | 0 °C | |
| Elongation | 89 % | |
| Storage modulus | 494 N/mm² (71,600 psi) | |
| Volume resistivity | 1.04 × 10¹⁶ Ω·cm | |
| Surface resistivity | 3.27 × 10¹⁵ Ω | |
| Dielectric constant / Dissipation factor @ 1.1 GHz | 2.76 / 0.031 | |
| Dielectric constant / Dissipation factor @ 1.9 GHz | 2.71 / 0.019 | |
| Dielectric constant / Dissipation factor @ 5 GHz | 2.69 / 0.0097 |
This formulation balances high electrical insulation, thermal stability, and mechanical flexibility, making it highly reliable for advanced encapsulation needs.
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