Applications

LOCTITE® ECCOBOND EN 3871 – Epoxy Encapsulant – OLED packaging and semiconductor encapsulation in electronics industry

  • Item Name: LOCTITE® ECCOBOND EN 3871

  • Manufacturer: Henkel

  • Technologies: Epoxy

  • Color: Clear liquid

  • Cure Type: Heat cure (120 min @ 85 °C)

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 180 days @ -20 °C

1. Product Overview
LOCTITE ECCOBOND EN 3871 is a one-component, optically clear epoxy encapsulant designed for semiconductor and OLED applications. It provides excellent transparency, UV resistance to prevent yellowing, and strong moisture protection. The adhesive cures by heat, offering reliable stability and durability under high humidity and elevated temperatures.

2. Applications

  • OLED packaging

  • Semiconductor encapsulation

  • Electronic devices requiring high moisture resistance and long-term optical clarity

3. Typical Properties

Property Still not mixed (Uncured) After mixed / Cured
Appearance Clear liquid Optically clear solid
Viscosity (25 °C, 5 rpm) 22,900 mPa·s
Work Life @ 25 °C 8 hours
Shelf Life @ –20 °C 180 days
Cure Schedule 120 min @ 85 °C
Coefficient of Thermal Expansion 77 ppm/°C (below Tg), 156 ppm/°C (above Tg)
Glass Transition Temp (Tg) 117 °C
Refractive Index 1.5
Storage Modulus @ 25 °C 2,246 N/mm² (325,754 psi)
Water Vapor Permeability (50 °C/100% RH) 6.9 g·mil/100 in²·day
Die Shear Strength (Glass/Glass, 4×4 mm) 14.5 kgf
Transmittance (100 µm laminate) >95% @ 400 nm, >97% @ 450 nm

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