Item Name: LOCTITE® ECCOBOND EN 3915T
Manufacturer: Henkel
Technologies: Epoxy
Color: Black liquid
Cure Type: Heat cure (7 min @160°C; alternatives at 150°C/130°C)
Package Size: Contact to Techniq VN for details.
Shelf Life: 9 months
LOCTITE® ECCOBOND EN 3915T is a black, epoxy-based encapsulant engineered for flip chip device applications. Its thixotropic formulation minimizes liquid migration after dispensing, while its low coefficient of thermal expansion and halogen-free design ensure excellent reliability. The product offers rapid thermal curing, making it suitable for high-throughput production where stability and long shelf life are critical.
Encapsulation of flip chip devices.
Protects substrates from mechanical stress and environmental factors.
Suitable for advanced semiconductor packaging requiring low CTE and high modulus.
| Condition | Property | Value |
|---|---|---|
| Still Not Mixed (Uncured) | Appearance | Black liquid |
| Viscosity (20 s⁻¹, Cone Rheometer) | 22,000 mPa·s | |
| Thixotropic index | 3.5 | |
| Specific gravity | 1.66 g/ml | |
| Pot life @ 25°C | 24 h | |
| Shelf life @ -40°C | 270 days | |
| Curing Performance | Recommended cure | 7 min @ 160°C |
| Alternate cure | 10 min @ 150°C or 20 min @ 130°C | |
| After Mixed (Cured) | Glass transition temperature (Tg) | 130 °C |
| Coefficient of thermal expansion (below Tg) | 24 ppm/°C | |
| Coefficient of thermal expansion (above Tg) | 103 ppm/°C | |
| Storage modulus @ 25°C | 9,400 N/mm² (9,400 psi) |
This adhesive is optimized for semiconductor encapsulation, balancing fast cure, low thermal expansion, and excellent mechanical integrity, ensuring robust protection of delicate flip chip assemblies.
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