Applications

LOCTITE® ECCOBOND EN 3940TX – Epoxy Encapsulant – Glob top and waterproof sealing for CSP/BGA connectors

  • Item Name: LOCTITE® ECCOBOND EN 3940TX

  • Manufacturer: Henkel

  • Technologies: Epoxy

  • Color: Black liquid

  • Cure Type: Heat cure (>8 min @ 130 °C)

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 270 days @ -20 °C

1. Product Overview
LOCTITE ECCOBOND EN 3940TX is a black, one-component epoxy adhesive formulated for glob top and encapsulation. It features thixotropic behavior, rapid curing at moderate temperatures, low glass transition temperature, and high flexibility. The product is halogen-free, offering enhanced environmental safety, and ensures effective waterproof sealing for electronic connectors.

2. Applications

  • Glob top encapsulation for CSP/BGA connectors

  • Waterproof sealing for connectors in electronic assemblies

  • Flexible encapsulant for devices requiring low modulus performance

3. Typical Properties

Property Still not mixed (Uncured) After mixed / Cured
Appearance Black liquid Black solid
Viscosity @ 25 °C (shear rate 20 mm²/20 s⁻¹) 2,275 mPa·s
Thixotropic Index (2/20 s⁻¹) 4.4
Pot Life @ 25 °C 3 days
Shelf Life @ –20 °C 270 days
Cure Schedule >8 min @ 130 °C
Hardness, Shore D 23
Glass Transition Temp (Tg) 2 °C
Coefficient of Thermal Expansion 54 ppm/°C (below Tg), 211 ppm/°C (above Tg)
Storage Modulus @ 25 °C 534 N/mm² (77,500 psi)

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