Item Name: LOCTITE® ECCOBOND EN 3942
Manufacturer: Henkel
Technologies: Epoxy
Color: Black liquid
Cure Type: Heat cure (30 min @ 150 °C)
Package Size: Contact to Techniq VN for details.
Shelf Life: 365 days @ -20 °C
1. Product Overview
LOCTITE ECCOBOND EN 3942 is a one-component, black epoxy encapsulant with thixotropic and fluorescent characteristics. It cures by heat at moderate temperatures, providing a flexible, low Tg material ideal for protecting sensitive PCB components. Once cured, the adhesive delivers strong physical protection, stable electrical performance, and resistance against temperature, humidity, and bias stress.
2. Applications
Glob top encapsulation for BGA and CSP packages
Connector protection
PCB component encapsulation requiring flexibility and durability under harsh environments
3. Typical Properties
| Property | Still not mixed (Uncured) | After mixed / Cured |
|---|---|---|
| Appearance | Black liquid | Black solid |
| Viscosity @ 25 °C, 10 rpm | 13,000 mPa·s | — |
| Thixotropic Index (1/10 rpm) | 1.5 | — |
| Work Life @ 25 °C | 3 days | — |
| Shelf Life @ –20 °C | 365 days | — |
| Cure Schedule | 30 min @ 150 °C | — |
| Glass Transition Temp (Tg) | — | 90 °C |
| Coefficient of Thermal Expansion | — | 55 ppm/°C (below Tg), 194 ppm/°C (above Tg) |
| Storage Modulus | — | 2,740 N/mm² |
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LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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