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LOCTITE® ECCOBOND F113SC – Epoxy adhesive for terminating fiber optic connectors in optoelectronic device assembly.

  • Item Name: LOCTITE ECCOBOND F113SC
  • Manufacturer: Henkel
  • Product Category: Epoxy Assembly Adhesive (for optical applications)
  • Technologies: Epoxy
  • Applications: Terminating fiber optic connectors, LED displays, lenses, and optoelectronic device assemblies
  • Color: Dark blue (mixed)
  • Cure Type: Room temperature cure or Heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

LOCTITE ECCOBOND F113SC is a high-performance epoxy adhesive designed for fiber optic applications. It offers:

  • High glass transition temperature (Tg)
  • Low viscosity for easy application
  • High bond strength
  • Low stress connections with no pistoning
  • Dark blue color for easy polishing
    It can be cured at room temperature or with heat.

2. Applications

  • Fiber optic connectors
  • LED displays
  • Lenses
  • Optoelectronic device assembly

3. Typical Properties

Uncured Properties

Property Value
Thixotropic Index 1.0
Viscosity (after mixing) 1,800 mPa·s (cP)
Specific Gravity (mixed) 1.1
Pot Life (25g) 35 min
Work Life (25g) 1 hour

Curing Performance

Cure Condition Time
Room Temperature 18 hours @ 25°C
Heat Cure 1 hour @ 65°C
Heat Cure (one drop applications) 15 minutes @ 90°C

Note: Sufficient cure for polishing connectors is achieved in 15 minutes @ 65°C.

Cured Properties

Property Value
Glass Transition Temperature (Tg) 95°C
Coefficient of Thermal Expansion (CTE) Below Tg: 7.57×10⁻⁵ cm/cm/°C
Above Tg: 1.91×10⁻⁴ cm/cm/°C
Hardness (Shore D) 83
Refractive Index 1.52
Water Absorption 0.98%

Bond Strength (Lap Shear Strength)

Condition Strength (psi)
1 hour @ 65°C 3,900
24 hours @ 25°C 2,700

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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