Applications

LOCTITE® ECCOBOND FP4323 – Epoxy glob top encapsulant for chip-on-board and plastic PGA applications.

  • Item Name: LOCTITE ECCOBOND FP4323
  • Manufacturer: Henkel
  • Product Category: Epoxy Encapsulant (Glob Top)
  • Technologies: Epoxy with 65% silica filler; two-component system (Component A: Black resin, Component B: Beige hardener)
  • Applications: Encapsulation for chip-on-board and Plastic PGA applications on plastic substrates
  • Color: Black (mixed)
  • Cure Type: Heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 12 months (at 25°C for individual components)

1. Product Overview

LOCTITE ECCOBOND FP4323 is a black epoxy-based encapsulant designed for glob top applications. It offers:

  • Low Coefficient of Thermal Expansion (CTE) for improved thermal cycling.
  • High purity, thixotropic properties, and excellent resistance to moisture and chemicals.
  • 65% silica filler content for enhanced mechanical strength.
  • Heat-cure system for strong adhesion and durability.

2. Applications

  • Encapsulant for chip-on-board (COB) and plastic pin grid array (PGA) applications.
  • Suitable for plastic substrates.
  • Provides flow control to prevent excessive spreading beyond the chip.

3. Typical Properties

Properties Part A Part B Mixed
Appearance Black Beige Black
Viscosity (25°C, mPa·s) 172,500 (2 rpm) / 115,000 (20 rpm) 250,000 (2 rpm) / 72,500 (20 rpm) 220,000 (2 rpm) / 100,000 (20 rpm)
Specific Gravity 1.7 1.7 1.67
Shelf Life 12 months (@ 25°C) 12 months (@ 25°C) 9 months (@ -40°C)
Pot Life (@ 25°C) 2 days
Work Life (@ 25°C) 48 hours
Gel Time (@ 121°C) 11 minutes

4. Curing Performance

Cure Schedule Conditions
Standard Cure 4 hours @ 150°C or 1 hour @ 170°C
Alternative Cure 2 hours @ 125°C + 4 hours @ 150°C
Recommended Preheat 90°C for best adhesion

5. Cured Material Properties

Property Value Test Method
Glass Transition Temperature (Tg) 174°C TMA
CTE (ppm/°C, <Tg) 28 ASTM D-3386
Thermal Conductivity (W/m-K) 0.63
Shore Hardness (D) 97 ISO 868
Water Absorption (8h @ 100°C, %) 0.25 ISO 62
Dielectric Constant (1 kHz / 100 MHz / 1 GHz) 3.7 / 3.59 / 3.44 IEC 60250
Volume Resistivity (Ω·cm) 6.2×10¹⁴ IEC 60093
Surface Resistivity (Ω) 1.6×10¹⁴ IEC 60093

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