LOCTITE ECCOBOND FP4451TD is a high-purity, heat-curing epoxy encapsulant designed as a damming material for bare chip encapsulation. It offers excellent chemical resistance and exceptional thermal stability.
| Property | Value |
|---|---|
| Uncured Properties | |
| Viscosity (Brookfield RVF, 25°C) | 300,000 mPa·s (cP) |
| Specific Gravity @ 25°C | 1.79 |
| Gel Time @ 121°C | 13 min |
| Pot Life @ 25°C | 10 days |
| Shelf Life @ -40°C | 274 days |
| Particle Size (median/max) | 20 µm / 200 µm |
| Curing Performance | |
| Cure Schedule | 30 min @ 125°C + 90 min @ 165°C |
| Cured Properties | |
| Coefficient of Thermal Expansion (ppm/°C) | 21 (below Tg) / 65 (above Tg) |
| Glass Transition Temperature (Tg) | 150°C |
| Extractable Ionic Content (Cl-, Na+, K+) | <10, <1, <1 |
| Electrical Properties | |
| Dielectric Constant @ 5 GHz | 3.52 |
| Dielectric Constant @ 50 GHz | 3.50 |
| Dissipation Factor @ 5 GHz | 0.0060 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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