Applications

LOCTITE® ECCOBOND FP4460 – Low-stress epoxy encapsulant for protecting bare semiconductor devices in electronics.

  • Item Name: LOCTITE ECCOBOND FP4460
  • Manufacturer: Henkel
  • Product Category: Epoxy Encapsulant (Glob Top)
  • Technologies: Epoxy with 75% silica filler
  • Applications: Encapsulation for protection of bare semiconductor devices in automotive applications, IC memory cards, chip carriers, hybrid circuits, chip-on-board, multi-chip modules, BGA, and pin grid arrays
  • Color: Black
  • Cure Type: Heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 9 months at -40°C

1. Product Overview

LOCTITE ECCOBOND FP4460 is a high-purity, low-stress epoxy encapsulant designed for glob top applications. It provides excellent chemical and moisture resistance, high flow properties, and long work life, making it suitable for high-temperature applications up to 150°C.

2. Applications

  • Automotive electronics
  • IC memory cards
  • Chip carriers & hybrid circuits
  • Chip-on-board (COB)
  • Multi-chip modules (MCM)
  • BGA & pin grid arrays
  • Semiconductor device encapsulation

3. Typical Properties

Property Value
Uncured Properties
Viscosity @ 25°C (Spindle 7, 4 rpm) 425,000 mPa·s (cP)
Viscosity @ 25°C (Spindle 7, 10 rpm) 300,000 mPa·s (cP)
Specific Gravity @ 25°C 1.78
Gel Time @ 121°C 10 min
Pot Life @ 25°C 2 days
Shelf Life @ -40°C 9 months
Curing Conditions
Recommended Cure 3 hours @ 150°C
Cured Properties
Coefficient of Thermal Expansion (CTE) below Tg 20 ppm/°C
Glass Transition Temperature (Tg) 173°C
Extractable Ionic Content:
– Chloride (Cl⁻) 13 ppm
– Sodium (Na⁺) 11 ppm
– Potassium (K⁺) 2 ppm
Linear Shrinkage 0.135%
Glob Height (0.2g mass) 1.8 mm

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