LOCTITE ECCOBOND FP4470 is a high-purity epoxy encapsulant with excellent flow properties, designed for electronic packaging applications. It is suitable for lead-free solder reflow processes (260°C) and offers high thermal and mechanical stability.
| Property | Value |
|---|---|
| Appearance | Black |
| Filler Weight (%) | 75 |
| Viscosity (25°C, Spindle 6, 10 rpm) | 42,000 mPa·s (cP) |
| Specific Gravity (25°C) | 1.8 |
| Pot Life (25°C) | 3 days |
| Shelf Life (-40°C) | 274 days |
| Condition | Time |
|---|---|
| Gel Time @ 121°C | 12 min |
| Cure Schedule | 30 min @ 125°C + 90 min @ 165°C |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) | 148°C |
| Coefficient of Thermal Expansion (ppm/°C) | 18 (below Tg), 65 (above Tg) |
| Extractable Ionic Content (ppm) | Cl- <2, Na+ <2, K+ 1 |
| Flexural Modulus (N/mm²) | 12,700 (@ 25°C), 600 (@ 240°C) |
| Flexural Strength (N/mm²) | 137,000 (@ 25°C), 17,000 (@ 240°C) |
| Volume Resistivity (Ω·cm) | 5×10¹⁶ |
| Dielectric Constant/Dissipation Factor @ 1 MHz | 3.5 / 0.01 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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