Applications

OCTITE® ECCOBOND FP4526 – Epoxy underfill for flip chip applications with low viscosity and fast flow.

  • Item Name: LOCTITE ECCOBOND FP4526
  • Manufacturer: Henkel
  • Product Category: Epoxy Underfill Adhesive
  • Technologies: Epoxy formulation with 63% silica filler
  • Applications: Underfill for ceramic packages and flip chip applications (ideal for high reliability, Hi-Pb and Pb-free applications)
  • Color: Blue
  • Cure Type: Heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Approximately 9 months (at -40°C)

1. Product Overview

LOCTITE ECCOBOND FP4526 is a blue epoxy underfill designed for capillary flow in flip chip applications. It has excellent wettability, adhesion, and flow properties, making it suitable for high-reliability applications, including both Hi-Pb and Pb-free environments.

2. Applications

  • Underfill for flip chip applications
  • Suitable for ceramic packages and flip chip on flex
  • Compatible with substrates such as ceramic, organic, solder mask, and polyimide

3. Typical Properties

Uncured Properties

Property Value
Viscosity (Brookfield, 25°C) 4,700 mPa·s
Specific Gravity 1.7
Maximum Particle Size 27 µm
Flow Rate (@ 90°C, 3 mil gap) 30 sec
Pot Life (@ 25°C) 36 hours
Gel Time (@ 121°C) 9 min
Shelf Life (@ -40°C) 274 days

Curing Performance

Cure Method Time & Temperature
Heat Sink / Hot Plate 15 min @ 165°C
Convection Oven 30 min @ 165°C

Cured Properties

Property Value
Coefficient of Thermal Expansion (Below Tg) 33 ppm/°C
Coefficient of Thermal Expansion (Above Tg) 101 ppm/°C
Glass Transition Temperature (Tg) 133°C
Flexural Modulus 8,500 N/mm²
Chloride (Cl⁻) Content 25 ppm
Sodium (Na⁺) Content 10 ppm

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