| Property | Value |
|---|---|
| Uncured Properties | |
| Viscosity (25°C, Brookfield CP52, 20 rpm) | 10,000 mPa·s (cP) |
| Filler Content (%) | 62 |
| Pot Life @ 25°C (hours) | 24 |
| Usable Dispensing Time (hours) | 8 |
| Shelf Life @ -40°C (days) | 270 |
| Curing Performance | |
| Gel Time @ 121°C (minutes) | 6 |
| Snap Cure Schedule | 7 min @ 160°C |
| Cured Properties | |
| Coefficient of Thermal Expansion (ppm/°C) | Below Tg: 28 / Above Tg: 104 |
| Glass Transition Temperature (Tg) (°C) | 161 |
| Chloride (Cl⁻) (ppm) | 20 |
| Sodium (Na⁺) (ppm) | 5 |
| Potassium (K⁺) (ppm) | 5 |
| Flexural Modulus (N/mm²) | 7,600 (1,102,000 psi) |
| Thermal Conductivity (W/m-K) | 0.61 |
| Electrical Properties | |
| Volume Resistivity (ohm-cm) | 1.71 × 10¹⁶ |
| Surface Resistivity (ohms) | 1.87 × 10¹⁶ |
| Dielectric Strength (V/mil) | 1,470 |
| Dielectric Constant / Dissipation Factor | |
| @ 100 KHz | 3.34 / 0.0088 |
| @ 1 MHz | 3.29 / 0.0071 |
| @ 2 MHz | 3.3 / 0.0073 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.