LOCTITE ECCOBOND FP4654 is a high-purity, low-stress, self-leveling epoxy encapsulant designed for cavity-fill or dam-and-fill applications. It offers excellent chemical resistance, thermal stability, and is jettable for precise dispensing.
| Property | Value |
|---|---|
| Appearance | Black |
| Viscosity (25°C, Spindle 52, 20 rpm) | 32,000 mPa·s (cP) |
| Pot Life @ 25°C | >3 days |
| Gel Time @ 121°C | 11 min |
| Shelf Life @ -40°C | 274 days |
| Specific Gravity @ 25°C | 1.85 |
| Cure Schedule | Condition |
|---|---|
| Primary Cure | 30 min @ 125°C |
| Post Cure | 90 min @ 165°C |
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion (ppm/°C) | Below Tg: 13, Above Tg: 53 |
| Glass Transition Temperature (Tg) | 146°C |
| Tensile Modulus (DMA) | 16,900 N/mm² (2,451,000 psi) |
| Extractable Ionic Content (ppm) | Cl⁻: 10, Na⁺: 5, K⁺: 5 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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