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LOCTITE® ECCOBOND LA 3032-78 – Epoxy encapsulant for inkjet and MEMS device assembly in electronics.

  • Item Name: LOCTITE ECCOBOND LA 3032-78
  • Manufacturer: Henkel
  • Product Category: Epoxy Encapsulant
  • Technologies: Epoxy, One-component, Fast cure, Chemical resistant
  • Applications: Inkjet applications, MEMS devices
  • Color: Yellow
  • Cure Type: Heat cure (15 min @ 100°C, 3 min @ 120°C, 45 sec @ 160°C)
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 60 days

1. Product Overview

LOCTITE ECCOBOND LA 3032-78 is a one-component, heat-curing epoxy encapsulant designed for high-throughput assembly operations. It features:

  • Fast cure at low temperatures
  • Excellent chemical resistance
  • High heat distortion resistance
  • Strong adhesion to engineering plastics

Ideal for: Inkjet applications and MEMS devices.


2. Applications

  • Encapsulation for MEMS and inkjet applications
  • Protection of sensitive electronic components
  • Bonding to engineering plastics

3. Typical Properties

Uncured Properties

Property Value
Appearance Yellow
Viscosity (Casson, 50 s⁻¹) 50,000 mPa·s (cP)
Shear Thinning Index 3.0
Density 1.32 g/cm³
Shelf Life (@ 0°C) 60 days

Curing Performance

Cure Schedule Time & Temperature
Heat Cure 15 min @ 100°C
Rapid Cure 3 min @ 120°C
Fastest Cure 45 sec @ 160°C

Cured Properties

Property Value
Hardness (Shore D) >84
Glass Transition Temperature (Tg) 110°C
Storage Modulus (25°C) 3,700 N/mm² (536,639 psi)
DSC Onset Temperature 116°C
DSC Peak Temperature 125°C
Enthalpy 285 J/g

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