LOCTITE ECCOBOND LA 3032-78 is a one-component, heat-curing epoxy encapsulant designed for high-throughput assembly operations. It features:
Ideal for: Inkjet applications and MEMS devices.
| Property | Value |
|---|---|
| Appearance | Yellow |
| Viscosity (Casson, 50 s⁻¹) | 50,000 mPa·s (cP) |
| Shear Thinning Index | 3.0 |
| Density | 1.32 g/cm³ |
| Shelf Life (@ 0°C) | 60 days |
| Cure Schedule | Time & Temperature |
|---|---|
| Heat Cure | 15 min @ 100°C |
| Rapid Cure | 3 min @ 120°C |
| Fastest Cure | 45 sec @ 160°C |
| Property | Value |
|---|---|
| Hardness (Shore D) | >84 |
| Glass Transition Temperature (Tg) | 110°C |
| Storage Modulus (25°C) | 3,700 N/mm² (536,639 psi) |
| DSC Onset Temperature | 116°C |
| DSC Peak Temperature | 125°C |
| Enthalpy | 285 J/g |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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