LOCTITE ECCOBOND LUX 3042M is a one-component, dual-cure acrylate adhesive designed for assembling temperature-sensitive electronic components. It initially cures under ultraviolet (UV) and visible light and achieves maximum performance through a secondary thermal cure. The product offers strong adhesion to various substrates and is non-conductive.
| Property | Value | Test Method |
|---|---|---|
| Viscosity (mPa·s) | 85,000 | TA Rheometer, Cone 20 mm, Angle 2º @ Shear rate 20 s⁻¹ |
| Thixotropic Index | 1.2 | – |
| Specific Gravity (g/cm³) | 1.1 | – |
| Flash Point | See SDS | – |
| Parameter | Value |
|---|---|
| Light Source | High Pressure Mercury Lamp |
| UV Wavelength (nm) | 300 – 500 |
| Light Intensity (mW/cm²) | 100 |
| Exposure Time (seconds) | 5 |
| Parameter | Value |
|---|---|
| Temperature | 120°C |
| Time | 30 minutes |
| Property | Value |
|---|---|
| Hardness (Shore D) | 85 |
| Coefficient of Thermal Expansion (Below Tg) | 87 ppm/°C |
| Coefficient of Thermal Expansion (Above Tg) | 174 ppm/°C |
| Glass Transition Temperature (Tg) | 114°C |
| Modulus (N/mm²) | 1,700 (247,000 psi) |
| Lap Shear Strength (FR4/FR4, 0.075 mm thickness) | >8 N/mm² |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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