LOCTITE ECCOBOND LUX 4047 is a high-viscosity, single-component, UV-curable acrylate adhesive designed for high-throughput optoelectronic assembly applications. It provides low shrinkage, excellent mechanical stability, and rapid curing when exposed to visible (blue) or UV light.
| Property | Value |
|---|---|
| Technology | Acrylate |
| Appearance | Opaque White |
| Cure Type | Ultraviolet (UV) light |
| Viscosity @ 25°C | 120,000 mPa·s (cP) |
| Shelf Life @ 5°C | 6 months |
| Shelf Life @ 25°C | 3 months |
| Parameter | Value |
|---|---|
| Recommended Cure | UV or visible light |
| Visible Light Wavelength | 470 nm (Blue) |
| UV Lamp Intensity | >150 mW/cm² |
| Cure Depth | 12 mm (unfilled), 5 mm (filled) |
| Cure Time | <1 minute |
| Property | Value |
|---|---|
| Hardness (Shore D) | 80 |
| Glass Transition Temperature (Tg) | 52°C (Loss of Modulus), 148°C (Tan Δ Max) |
| Flexural Modulus | 7,901 N/mm² (1,146,000 psi) |
| Linear Shrinkage on Cure | 1.1% |
| Water Absorption (24 hrs) | 0.07% |
| Coefficient of Linear Expansion | Below Tg: 20×10⁻⁶ in/in/°C, Above Tg: 75×10⁻⁶ in/in/°C |
| Property | Value |
|---|---|
| Lap Shear Strength @ 25ºC (Glass to Glass) | 1,200 psi |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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