LOCTITE ECCOBOND LUX A4021T is a single-pack, photocurable acrylate adhesive designed for high-performance optical and optoelectronic applications. It features a high refractive index, low shrinkage, and excellent adhesion to glass and steel. The adhesive cures rapidly under UV (365 nm) or visible light (470 nm) and has a secondary thermal cure option for shadowed areas. It is formulated to enhance productivity in fiber optics and optoelectronic device assembly.
LOCTITE ECCOBOND LUX A4021T is widely used in the optoelectronics and photonics industry for:
| Property | Value |
|---|---|
| Technology | Acrylate |
| Color | Pale yellow |
| Viscosity (25°C, 10 rpm) | 60,000 mPa·s (cP) |
| Flash Point | See SDS |
| Shelf Life (25°C) | 91 days (3 months) |
| Shelf Life (5°C) | 183 days (6 months) |
| Cure Method | Condition |
|---|---|
| UV Light (365 nm) | 50 mW/cm² |
| Visible Light (470 nm) | 100 mW/cm² |
| Secondary Thermal Cure | 1 hour @ 100°C or 2 hours @ 85°C |
| Property | Value |
|---|---|
| Hardness (Shore D) | 79 |
| Glass Transition Temperature (Tg) | 112°C |
| Coefficient of Thermal Expansion (Above Tg) | 110 ppm/°C |
| Water Absorption (24 hrs) | 0.13% |
| Flexural Modulus (DMTA) | 435,110 psi |
| Refractive Index (589 nm) | 1.589 |
| Refractive Index (1,320 nm) | 1.569 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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