1. Product Overview
LOCTITE ECCOBOND LUX A4035T is a pale yellow, single-pack, photocurable acrylate adhesive designed for optical and optoelectronic assembly. It cures under UV, visible light, and heat, making it ideal for thin bondline applications.
2. Applications
3. Typical Properties
| Property | Value |
|---|---|
| Uncured Properties | |
| Viscosity (Brookfield, 10 rpm, 25°C) | 500 mPa·s (cP) |
| Shelf Life (@25°C) | 91 days |
| Shelf Life (@0-5°C) | 183 days |
| Curing Performance | |
| UV Wavelength | 365 nm |
| Light Intensity (UV) | 50 mW/cm² |
| Visible Light Wavelength | 470 nm |
| Light Intensity (Visible) | 100 mW/cm² |
| Thermal Cure Conditions | 1 hr @100°C or 2 hrs @80°C |
| Linear Shrinkage on Cure | 2.4% |
| Cured Properties | |
| Coefficient of Thermal Expansion (below Tg) | 110 ppm/°C |
| Glass Transition Temperature (Tg) | 145°C |
| Hardness (Shore D) | 82 |
| Refractive Index | |
| @ 589 nm | 1.572 |
| @ 633 nm | 1.569 |
| @ 830 nm | 1.559 |
| @ 1320 nm | 1.548 |
| @ 1550 nm | 1.553 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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