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LOCTITE® ECCOBOND LUX OGR150THTG – Photocurable acrylate adhesive for high-throughput optoelectronic assembly operations.

  • Item Name: LOCTITE ECCOBOND LUX OGR150THTG
  • Manufacturer: Henkel
  • Product Category: Adhesive (Photocurable)
  • Technologies: Acrylate, UV Cure, Secondary Thermal Cure
  • Applications: Optoelectronic assembly, bonding in shadowed areas
  • Color: Colorless
  • Cure Type: Ultraviolet (UV) light, Secondary Thermal Cure (1 hour @ 100°C or 2 hours @ 85°C)
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 6 months

1. Product Overview

LOCTITE ECCOBOND LUX OGR150THTG is a single-component, UV and thermal-curable acrylate adhesive designed for high-throughput optoelectronic assembly. Key benefits include:

  • Fast UV cure with secondary thermal cure for shadowed areas
  • High glass transition temperature (Tg) for stability
  • Non-conductive and photocurable formulation
  • Low-temperature cure capability

Ideal for: Optoelectronic assembly where rapid curing and high-temperature resistance are required.


2. Applications

  • Bonding and assembly in optoelectronic devices
  • Applications requiring dual curing (UV and thermal)
  • High-volume industrial assembly

3. Typical Properties

Uncured Properties

Property Value
Technology Acrylate
Color Colorless
Viscosity @ 25°C (Brookfield, 10 rpm) 1,000 mPa·s (cP)
Work Life @ 25°C 91 days
Shelf Life (-5°C to +5°C) 183 days

Curing Performance

Cure Method Conditions
UV Cure 365 nm, 110 mW/cm² at bondline
Thermal Cure (Secondary Cure for Shadowed Areas) 1 hour @ 100°C or 2 hours @ 85°C

Cured Properties

Property Value
Hardness (Shore D) 76
Glass Transition Temperature (Tg) 145°C
Refractive Index (589 nm) 1.5202
Coefficient of Thermal Expansion (Below Tg) 61 ppm/°C
Coefficient of Thermal Expansion (Above Tg) 157 ppm/°C
Moisture Absorption @ 85°C/85% RH 1.62%

Tensile Modulus

Temperature N/mm² psi
-65°C 2,200 320,000
25°C 1,300 190,000
100°C 380 54,000
150°C 75 11,000

Die Shear Strength (Alumina Die to Glass)

Condition Strength (kg-f/die)
Post Cure @ 25°C 3.8
Post Cure @ 25°C with Silane 19

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