LOCTITE ECCOBOND LUX OGR150THTG is a high-Tg, non-conductive, photocurable adhesive based on acrylate technology. It is designed for high-throughput optoelectronic assembly operations. The adhesive cures rapidly under ultraviolet (UV) light and has a secondary thermal cure mechanism for shadowed areas. This single-component adhesive provides excellent mechanical strength, high refractive index stability, and low moisture absorption.
| Property | Value | Unit |
|---|---|---|
| Technology | Acrylate | – |
| Color | Colorless | – |
| Viscosity (Brookfield, SPD#27, 25°C, 10 rpm) | 1,000 | mPa·s (cP) |
| Work Life (@25°C) | 91 | days |
| Shelf Life (@-5 to +5°C) | 183 | days |
| Cure Method | Condition |
|---|---|
| UV Cure | UV 365 nm with 110 mW/cm² at the bondline |
| Secondary Thermal Cure | 1 hour @ 100°C or 2 hours @ 85°C |
| Property | Value | Unit |
|---|---|---|
| Hardness (Shore D) | 76 | – |
| Refractive Index @ 589 nm | 1.5202 | – |
| Glass Transition Temperature (Tg) | 145 | °C |
| Coefficient of Thermal Expansion (Below Tg) | 61 | ppm/°C |
| Coefficient of Thermal Expansion (Above Tg) | 157 | ppm/°C |
| Moisture Absorption @ Saturation (85°C/85% RH) | 1.62 | wt.% |
| Temperature | Modulus | Unit |
|---|---|---|
| -65°C | 2,200 | N/mm² (320,000 psi) |
| 25°C | 1,300 | N/mm² (190,000 psi) |
| 100°C | 380 | N/mm² (54,000 psi) |
| 150°C | 75 | N/mm² (11,000 psi) |
| Condition | Strength | Unit |
|---|---|---|
| Post Cure @25°C | 3.8 | kg-f/die |
| Post Cure @25°C with Silane | 19 | kg-f/die |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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