LOCTITE ECCOBOND LUX OGRFI146T is a single-component, photocurable adhesive specifically designed for optical, fiber optic, and optoelectronic device assembly. This acrylate-based adhesive offers a low refractive index, making it ideal for high-precision optical applications. It cures rapidly under UV or visible light and also features a secondary thermal cure mechanism for shadowed areas where light cannot penetrate. The product is designed for bonding silicon and ceramics and ensures high productivity in assembly processes.
| Property | Value |
|---|---|
| Technology | Acrylate |
| Color | Clear |
| Viscosity (Brookfield, 25°C) | 1,250 mPa·s (Spindle 27, 10 rpm) |
| Work Life (25°C) | 91 days |
| Shelf Life (0 to 5°C) | 183 days |
| Shelf Life (25°C) | 91 days |
| Cure Type | Condition |
|---|---|
| UV Cure | 500 mW/cm² for 8 seconds (or 4,000 mJ/cm²) |
| Visible Light Cure | 600 mW/cm² for 30 seconds (or 18 J/cm²) |
| Thermal Cure | 1 hour at 100°C or 2 hours at 85°C |
| Property | Value |
|---|---|
| Hardness (Shore D) | 64 |
| Glass Transition Temperature (Tg) | 85°C (DMTA), 188°C (DSC) |
| Coefficient of Thermal Expansion | Below Tg: 71 ppm/°C, Above Tg: 214 ppm/°C |
| Water Absorption (85°C/85 RH) | 1.5% |
| Refractive Index | 1.463 (589 nm), 1.449 (1,550 nm) |
| Temperature | Value |
|---|---|
| -65°C | 1,600 N/mm² (240,000 psi) |
| 25°C | 650 N/mm² (94,000 psi) |
| 100°C | 7.2 N/mm² (1,100 psi) |
| 150°C | 3.4 N/mm² (500 psi) |
| 200°C | 4.4 N/mm² (640 psi) |
| Condition | Adhesion Strength |
|---|---|
| @ 25°C | 20.1 N/mm² (2,910 psi) |
| @ 25°C w/ Silane | 18.3 N/mm² (2,650 psi) |
| After 1,000 hrs @ 85°C/85% RH | 4.5 N/mm² (650 psi) |
| After 72 hrs PCT, 121°C @ 100% RH | 3.2 N/mm² (470 psi) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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