LOCTITE ECCOBOND LV4518-38 is a yellow-green, one-component acrylate sealant designed for gold and various plastic substrates. It offers UV curing with a secondary heat cure for shadowed areas, enabling fast processing. The product is thixotropic, solvent-resistant, and phosphorescent for inspection purposes.
| Properties | Values |
|---|---|
| Unmixed Properties | |
| Technology | Acrylate |
| Appearance | Yellow-green liquid |
| Viscosity (Brookfield, Spindle 5, 10 rpm, 25°C) | 42,000 mPa·s (cP) |
| Thixotropic Index (1/10 rpm) | 6.5 |
| Shelf Life (@ 0 to 4°C) | 60 days |
| Curing Properties | |
| Primary Cure | Ultraviolet (UV) light |
| Secondary Cure (for shadowed areas) | Heat cure at 110°C for 20 minutes |
| Recommended UV Light Source | Fusion D UV Lamp |
| Light Intensity | 200 W/in |
| UV Exposure Time | 5 seconds |
| Depth of Cure (UV) | 60 mils |
| Cured Properties | |
| Hardness (Shore D) | 50 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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