LOCTITE ECCOBOND OGR 146TUV is a single-component, UV-curable acrylate adhesive designed for high-throughput assembly applications, particularly in optical and optoelectronic device bonding. It features a secondary thermal cure mechanism for applications with shadowed areas, ensuring strong adhesion and enhanced moisture resistance.
| Property | Value | Test Method |
|---|---|---|
| Viscosity (Brookfield CP51, 25°C) | 1,250 mPa·s | Speed 5 rpm |
| Work Life @ 25°C | 91 days | – |
| Shelf Life @ -5 to +5°C | 183 days | – |
| Flash Point | See SDS | – |
| Parameter | Value |
|---|---|
| UV Wavelength | 365 nm |
| Light Intensity | ≥110 mW/cm² |
| Parameter | Value |
|---|---|
| Temperature | 100°C (1 hour) / 85°C (2 hours) |
| Atmosphere | Nitrogen (optional, enhances bond strength & moisture resistance) |
| Property | Value |
|---|---|
| Hardness (Shore D) | 60 |
| Refractive Index @ 589 nm | 1.464 |
| Refractive Index @ 633 nm | 1.462 |
| Refractive Index @ 830 nm | 1.458 |
| Refractive Index @ 1,320 nm | 1.455 |
| Refractive Index @ 1,550 nm | 1.454 |
| Coefficient of Thermal Expansion (Below Tg) | 62 ppm/°C |
| Coefficient of Thermal Expansion (Above Tg) | 215 ppm/°C |
| Glass Transition Temperature (Tg) | 77°C |
| Tensile Modulus @ 25°C | 635 N/mm² (92,000 psi) |
| Moisture Absorption @ Saturation (85°C / 85% RH) | 1.7% |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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