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LOCTITE ECCOBOND UF 1173 – Epoxy Underfill – Semiconductor & Electronics Assembly

Item Name: LOCTITE ECCOBOND UF 1173
Manufacturer: Henkel
Technologies: Epoxy
Color: Black liquid
Cure Type: Heat cure (5 minutes @ 150°C)
Package Size: Contact to Techniq VN for details.
Shelf Life: 6 months

1. Product Overview
LOCTITE ECCOBOND UF 1173 is a one-component, heat-cured epoxy underfill formulated for semiconductor packaging. It provides a uniform, void-free encapsulant that enhances solder joint reliability in CSP and BGA devices. With low coefficient of thermal expansion (CTE), long pot life, and strong stress-dissipation capability, it improves thermal cycling performance by distributing stress away from solder joints. The product is free from reportable REACH SVHCs (as of June 2018) and is not classified as CMR, making it a safe and reliable choice for electronic applications.

2. Applications
This material is designed for second-level underfill in semiconductor assembly, especially for CSP and BGA packages. It provides void-free encapsulation that supports solder joint integrity during temperature cycling. It is suited for high-frequency applications requiring stable dielectric performance and excellent environmental reliability, making it valuable in advanced electronics and aerospace-grade assemblies.

3. Typical Properties

Property Uncured Material Cured Material
Viscosity @ 10 s⁻¹ 7.5 Pa·s
Thixotropic Index 0.71
Density 1.69 g/cm³
Pot Life @ 25°C 48 hours
Shelf Life @ -40°C 180 days (est.)
Cure Schedule 5 min @ 150°C
Glass Transition Temperature 160 °C
CTE 26 ppm/°C (below Tg); 103 ppm/°C (above Tg)
Storage Modulus @ 25°C 6,000 MPa
Dielectric Constant / Df 3.18–3.29 / 0.0176–0.0360 (5–50 GHz)
Outgassing (NASA) TML: 0.43%; CVCM: 0.02%; WVR: 0.1%

LOCTITE ECCOBOND UF 1173 ensures excellent solder joint protection with robust mechanical, electrical, and outgassing properties, making it ideal for high-reliability electronic packaging applications.

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