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LOCTITE ECCOBOND UF 3513HF – Adhesive – Underfill, Encapsulant

-Item Name: LOCTITE ECCOBOND UF 3513HF
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Translucent, pale yellow
-Cure Type: Heat cure
-Package Size: Contact to Techniq VN for details.
-Shelf Life: 6 months

1. Product Overview

LOCTITE ECCOBOND UF 3513HF is a halogen-free epoxy underfill encapsulant designed for CSP and BGA applications. It offers fast curing at moderate temperatures, good adhesion to various substrates, and stable electrical performance under temperature humidity bias conditions. The one-component formulation simplifies processing, making it ideal for electronics protection.

2. Applications

LOCTITE ECCOBOND UF 3513HF is used for:

  • Underfill encapsulation for CSP/BGA connectors
  • Protection of electronic components from mechanical and moisture-related stresses
  • High-reliability electronics requiring strong adhesion and electrical stability

3. Typical Properties

Uncured Properties

Property Value
Appearance Translucent, pale yellow liquid
Viscosity @ 25°C (mPa·s) 3,300 (Brookfield CP51, 20 rpm)
Pot Life @ 25°C 3 days
Shelf Life @ 2 to 8°C 180 days (6 months)

Curing Performance

Cure Schedule Condition
80°C 30 minutes
100°C 20 minutes
120°C 10 minutes

Cured Properties

Property Value
Glass Transition Temperature (Tg) 75.2°C
Coefficient of Thermal Expansion (CTE) (Below Tg) 60.4 ppm/°C
Coefficient of Thermal Expansion (CTE) (Above Tg) 197.7 ppm/°C

Electrical Properties

Test Result
Surface Insulation Resistance (65°C/%RH, IPC B24 format) Pass

Shear Strength

Test Condition Shear Strength
Grit Blasted Steel on Solder Mask 21.5 N/mm² (3,118 psi)

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