-Item Name: LOCTITE ECCOBOND UF 3513HF
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Translucent, pale yellow
-Cure Type: Heat cure
-Package Size: Contact to Techniq VN for details.
-Shelf Life: 6 months
LOCTITE ECCOBOND UF 3513HF is a halogen-free epoxy underfill encapsulant designed for CSP and BGA applications. It offers fast curing at moderate temperatures, good adhesion to various substrates, and stable electrical performance under temperature humidity bias conditions. The one-component formulation simplifies processing, making it ideal for electronics protection.
LOCTITE ECCOBOND UF 3513HF is used for:
| Property | Value |
|---|---|
| Appearance | Translucent, pale yellow liquid |
| Viscosity @ 25°C (mPa·s) | 3,300 (Brookfield CP51, 20 rpm) |
| Pot Life @ 25°C | 3 days |
| Shelf Life @ 2 to 8°C | 180 days (6 months) |
| Cure Schedule | Condition |
|---|---|
| 80°C | 30 minutes |
| 100°C | 20 minutes |
| 120°C | 10 minutes |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) | 75.2°C |
| Coefficient of Thermal Expansion (CTE) (Below Tg) | 60.4 ppm/°C |
| Coefficient of Thermal Expansion (CTE) (Above Tg) | 197.7 ppm/°C |
| Test | Result |
|---|---|
| Surface Insulation Resistance (65°C/%RH, IPC B24 format) | Pass |
| Test Condition | Shear Strength |
|---|---|
| Grit Blasted Steel on Solder Mask | 21.5 N/mm² (3,118 psi) |
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