-Item Name: LOCTITE® ECCOBOND UF 3712
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Techniq VN for details.
-Shelf Life: 6 months
LOCTITE® ECCOBOND UF 3712 is a one-component epoxy adhesive designed for edgebond and encapsulation applications. It enhances reliability performance for big chips by providing a uniform and void-free encapsulant. The formulation improves temperature cycling capability and distributes stress away from solder connections.
Key Features:
| Property | Value |
|---|---|
| Appearance | Black liquid |
| Viscosity (25°C, 20 rpm) | 11,600 mPa.s |
| Thixotropic Index (2/20 rpm) | 3.8 |
| Specific Gravity (25°C) | 1.57 |
| Work Life (25°C) | ≥24 hours |
| Shelf Life (-20°C) | 180 days |
| Cure Schedule | Condition |
|---|---|
| Standard Cure | 30 min @ 125°C |
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion (CTE) | |
| – Below Tg | 32 µm/m/K |
| – Above Tg | 115 µm/m/K |
| Glass Transition Temperature (Tg) | 133°C |
| Tensile Modulus (DMA) | |
| – @ 25°C | 7,800 MPa |
| – @ 125°C | 2,500 MPa |
| Cure Shrinkage (Volume) | 1.6% |
| Water Absorption (168h, 85°C, 85% RH) | 0.5% |
| Die Shear Strength (2x1x0.5mm³ FR4) | 11 kgf |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
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LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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