Applications

LOCTITE® ECCOBOND UF 3800 – Epoxy underfill for CSP/BGA applications, providing mechanical stress protection for solder joints.

  • Item Name: LOCTITE ECCOBOND UF 3800
  • Manufacturer: Henkel
  • Product Category: Underfill Adhesive
  • Technologies: Epoxy (one-component, reworkable)
  • Applications: Underfill for chip scale packages and BGA in CSP applications
  • Color: Black liquid
  • Cure Type: Heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Approximately 9 months (at -20°C)

1. Product Overview

LOCTITE ECCOBOND UF 3800 is a reworkable, one-component epoxy underfill designed for CSP and BGA applications. It offers:

  • High Tg (69°C)
  • Fast cure at moderate temperatures (≥8 minutes @ 130°C)
  • Room temperature flow capability
  • Minimal stress on components
  • Stable electrical performance in temperature humidity bias
  • Compatibility with Pb-free and halogen-free solders

2. Applications

  • Underfill for Chip Scale Packages (CSP) and Ball Grid Arrays (BGA)
  • Provides mechanical stress protection for solder joints

3. Typical Properties

Property Value
Uncured Properties
Viscosity @ 25°C (mPa·s) 375
Specific Gravity 1.13
Pot Life @ 25°C (days) 3
Shelf Life @ -20°C (days) 274
Curing Performance
Recommended Cure Schedule ≥8 minutes @ 130°C
Cured Properties
Coefficient of Thermal Expansion (ppm/°C) Below Tg: 52 Above Tg: 188
Glass Transition Temperature (Tg) 69°C
Storage Modulus @ 25°C (GPa) 3.08
Electrical Properties
Dielectric Constant @ 23°C 1GHz: 2.97 2GHz: 2.8
Dissipation Factor @ 23°C 1GHz: 0.0174 2GHz: 0.0022

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