1. Product Overview

Product Name: LOCTITE® ECCOBOND UF 3808
Technology: Epoxy
Appearance: Black liquid
Components: One-component
Cure Type: Heat cure
Key Benefits:

• High glass transition temperature (Tg)
• Low coefficient of thermal expansion (CTE)
• Reworkable
• Halogen-free
• Room temperature flow capability
• Fast cure at moderate temperatures
• Compatible with most Pb-free solders
• Stable electrical performance in temperature humidity bias

Application: Underfill
Typical Assembly Applications: Chip scale packages (CSP) and ball grid arrays (BGA)

2. Applications

LOCTITE® ECCOBOND UF 3808 is a capillary underfill designed to:

• Cure quickly at low temperatures, minimizing stress on other components.
• Provide excellent mechanical properties to protect solder joints during thermal cycling.