• Item Name: LOCTITE ECCOBOND UF 3811
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Black liquid
• Cure Type: Heat cure (7–60 minutes @ 100–150°C)
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
1. Product Overview
LOCTITE ECCOBOND UF 3811 is a one-component, reworkable epoxy underfill designed for CSP and BGA applications. It features room-temperature flow capability without preheating, fast curing at moderate temperatures, and excellent thermal cycling reliability. The material is halogen-free and maintains stable electrical performance under Surface Insulation Resistance (SIR) testing. Once cured, it delivers high glass transition temperature with retained flexibility, protecting solder joints during both thermal cycling and mechanical stress such as drop testing.
2. Applications
The adhesive is primarily used as an underfill and encapsulant for chip scale packages (CSP) and ball grid arrays (BGA). Its reworkability and reliable stress protection make it suitable for advanced semiconductor packaging where long-term electrical stability and thermal cycling durability are required.
3. Typical Properties
| Property | Uncured Material | Cured Material |
|---|---|---|
| Viscosity @ 25°C | 354 mPa·s | – |
| Specific Gravity | 1.16 | – |
| Pot Life @ 25°C | 3 days | – |
| Shelf Life @ -20°C | 365 days | – |
| Cure Schedule | 60 min @ 100°C / 30 min @ 110°C / 10 min @ 130°C / 7 min @ 150°C | – |
| Glass Transition Temperature | – | 124 °C |
| CTE | – | 61 ppm/°C (below Tg); 190 ppm/°C (above Tg) |
| Storage Modulus @ 25°C | – | 2,445 MPa (354,617 psi) |
| Thermal Conductivity | – | 0.23 W/m·K |
| Surface Insulation Resistance | – | 1×10¹⁰ ohms (60°C/90% RH, 168 h) |
| Outgassing (NASA) | – | TML: 0.45%; CVCM: 0.04%; WVR: 0.31% |
This product combines ease of use, reworkability, and strong reliability, making it well-suited for protecting solder joints in high-performance electronic assemblies.
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