-Item Name: LOCTITE ECCOBOND UF 3812
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Techniq VN for details.
-Shelf Life: 6 months
LOCTITE ECCOBOND UF 3812 is a reworkable epoxy underfill designed for use in CSP, WLCSP, and BGA applications. It flows at room temperature without preheating and cures quickly at moderate temperatures, reducing stress on components. The formulation provides high glass transition temperature (Tg) and high fracture toughness, ensuring excellent protection of solder joints during thermal cycling. This halogen-free material is also compatible with most Pb-free solders and offers stable electrical performance under thermal/humidity bias.
LOCTITE ECCOBOND UF 3812 is used for:
| Property | Uncured (Not Mixed) | Cured (After Mixing & Curing) |
|---|---|---|
| Appearance | Black liquid | Solid |
| Viscosity @ 25°C (mPa·s) | 350 (at shear rate 1,000 s⁻¹) | N/A |
| Specific Gravity | 1.23 | N/A |
| Pot Life @ 25°C | 3 days | N/A |
| Work Life @ 25°C | 1 day | N/A |
| Shelf Life @ -20°C | 180 days (6 months) | N/A |
| Cure Schedule | >10 minutes @ 130°C | Fully cured |
| Glass Transition Temperature (Tg) | N/A | 131°C |
| Coefficient of Thermal Expansion (CTE) | N/A | 48 ppm/°C (below Tg), 175 ppm/°C (above Tg) |
| Storage Modulus @ 25°C (N/mm²) | N/A | 3,004 (435,580 psi) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
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LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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