• Item Name: LOCTITE ECCOBOND UF 3812
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Black liquid
• Cure Type: Heat cure (>10 minutes @ 130°C)
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 6 months
1. Product Overview
LOCTITE ECCOBOND UF 3812 is a halogen-free, one-component, reworkable epoxy underfill designed for CSP, WLCSP, and BGA packages. It features room-temperature flow without preheating, rapid curing at moderate temperatures, and strong thermal cycling reliability. With a high glass transition temperature (Tg) and excellent fracture toughness, it provides robust protection for solder joints under thermal stress. The material is compatible with most Pb-free solders and demonstrates stable electrical performance under thermal/humidity bias conditions.
2. Applications
This underfill is used for semiconductor packaging, particularly for CSP, WLCSP, and BGA devices. Its easy reworkability and excellent thermal cycling resistance make it suitable for high-reliability electronics where solder joint integrity is critical, including consumer electronics, telecommunications, and advanced computing devices.
3. Typical Properties
| Property | Uncured Material | Cured Material |
|---|---|---|
| Viscosity @ 25°C (1,000 s⁻¹) | 350 mPa·s | – |
| Specific Gravity | 1.23 | – |
| Pot Life @ 25°C | 3 days | – |
| Work Life @ 25°C | 1 day | – |
| Shelf Life @ -20°C | 180 days | – |
| Cure Schedule | >10 min @ 130°C | – |
| Glass Transition Temperature | – | 131 °C |
| CTE | – | 48 ppm/°C (below Tg); 175 ppm/°C (above Tg) |
| Storage Modulus @ 25°C | – | 3,004 MPa (435,580 psi) |
This product balances flowability, toughness, and reworkability, ensuring strong solder joint reliability and long-term performance in demanding electronic assemblies.
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.