-Item Name: LOCTITE ECCOBOND UF 3912
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Techniq VN for details.
-Shelf Life: 9 month
LOCTITE ECCOBOND UF 3912 is a black, one-component epoxy underfill encapsulant specifically designed for flip chip applications. It offers high thermal stability, excellent mechanical strength, and strong adhesion properties. The product is snap-curable, halogen-free, and reworkable, making it a reliable choice for advanced electronic packaging. It features fast flow characteristics, high glass transition temperature (Tg), and superior thermal cycling performance, ensuring stable electrical performance under harsh environmental conditions.
| Properties | Uncured State (Before Mixing) |
|---|---|
| Appearance | Black liquid |
| Viscosity (Brookfield, 25°C) | 3,500 mPa·s (cP) |
| Specific Gravity | 1.6 |
| Thixotropic Index | 1 |
| Work Life (25°C) | 24 hours |
| Shelf Life (-40°C) | 9 months (274 days) |
| Properties | Cured State (After Mixing) |
|---|---|
| Cure Condition | 7 minutes @ 160°C |
| Glass Transition Temperature (Tg) | 127°C |
| Coefficient of Thermal Expansion (CTE) – Below Tg | 28 ppm/°C |
| Coefficient of Thermal Expansion (CTE) – Above Tg | 105 ppm/°C |
| Storage Modulus (DMA @ 25°C) | 8,100 N/mm² (1.17×10⁶ psi) |
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