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LOCTITE ECCOBOND UF 3912 – Adhesive – Encapsulant, Underfill for Flip Chip Applications

-Item Name: LOCTITE ECCOBOND UF 3912
-Manufacturer: Henkel
-Technologies: Epoxy
-Color: Black
-Cure Type: Heat cure
-Package Size: Contact to Techniq VN for details.
-Shelf Life: 9 month

1. Product Overview

LOCTITE ECCOBOND UF 3912 is a black, one-component epoxy underfill encapsulant specifically designed for flip chip applications. It offers high thermal stability, excellent mechanical strength, and strong adhesion properties. The product is snap-curable, halogen-free, and reworkable, making it a reliable choice for advanced electronic packaging. It features fast flow characteristics, high glass transition temperature (Tg), and superior thermal cycling performance, ensuring stable electrical performance under harsh environmental conditions.

2. Applications

  • Underfill encapsulant for flip chip devices
  • Suitable for applications requiring high thermal cycling performance
  • Compatible with most Pb-free solders
  • Provides high fracture toughness and easy reworkability

3. Typical Properties

Properties Uncured State (Before Mixing)
Appearance Black liquid
Viscosity (Brookfield, 25°C) 3,500 mPa·s (cP)
Specific Gravity 1.6
Thixotropic Index 1
Work Life (25°C) 24 hours
Shelf Life (-40°C) 9 months (274 days)
Properties Cured State (After Mixing)
Cure Condition 7 minutes @ 160°C
Glass Transition Temperature (Tg) 127°C
Coefficient of Thermal Expansion (CTE) – Below Tg 28 ppm/°C
Coefficient of Thermal Expansion (CTE) – Above Tg 105 ppm/°C
Storage Modulus (DMA @ 25°C) 8,100 N/mm² (1.17×10⁶ psi)

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