Applications

Accessories
Adhesives
Cleaners
Equipment
Lubricants
Others
Primer, Activator
Solder Materials
Solvent
Tapes
Technology
Thermal Management

LOCTITE® ECCOBOND UV 9052 – Acrylate Encapsulant – UV/Moisture Cure Adhesive for Inkjet and Electronic Devices

Item Name: LOCTITE® ECCOBOND UV 9052
Manufacturer: Henkel
Technologies: Acrylate
Color: Translucent light blue
Cure Type: Ultraviolet (UV) / Moisture cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 3 months

1. Product Overview
LOCTITE ECCOBOND UV 9052 is a translucent light blue, single-component acrylate adhesive formulated for ink jet encapsulation. It cures rapidly under UV light and continues curing in shadowed areas through ambient moisture. The material demonstrates excellent ink resistance, non-stringing behavior, and reliable flow properties, making it highly suitable for precision dispensing systems.

2. Applications
This product is primarily used in ink jet applications as an encapsulant. It adheres effectively to substrates such as silicon, plastics, and a variety of other materials, providing robust performance in environments with UV exposure and ink contact.

3. Typical Properties

Property Uncured Cured
Appearance Translucent light blue Solid adhesive encapsulant
Thixotropic Index 6
Viscosity (5 s⁻¹ / 50 s⁻¹), mPa·s 41,000 / 6,400
Shelf life @ -20°C 91 days
Cure mechanism UV / moisture Fully crosslinked
Recommended UV cure 0.5–1 Joule; 5–10 sec exposure
Depth of cure >125 mils
Hardness >40 Shore A (UV), >30 Shore D (UV + moisture)
Photo DSC (peak time) 2.1 minutes

Its combination of fast UV cure, moisture post-cure, and high ink resistance makes ECCOBOND UV 9052 a dependable choice for modern ink jet device encapsulation.

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

RELATED PRODUCT

Contact Technical Support

Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.

(+84) 889 901 929

Email: info@techniq.vn

Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).

For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.