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LOCTITE® ECCOBOND UV 9060F – UV/moisture cure encapsulant for local circuit board protection in electronics.

  • Item Name: LOCTITE® ECCOBOND UV 9060F
  • Manufacturer: Henkel
  • Product Category: Encapsulant/Assembly Adhesive
  • Technologies: Acrylate
  • Applications: Local protection of WLCSP and BGA on circuit boards
  • Color: Translucent light blue
  • Cure Type: Ultraviolet (UV) cure with moisture cure for shadowed areas
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 6 months (at 5°C)

1. Product Overview

LOCTITE® ECCOBOND UV 9060F is a UV/moisture cure acrylate encapsulant designed for local circuit board protection. It is a fast-curing, one-component adhesive that can cure in shadowed areas and is fluorescent under UV light for easy inspection.

Key Benefits:
✔ Fast cure
✔ One-component system
✔ Easy to dispense without stringing
✔ Fluorescent under UV light


2. Applications

  • Local protection of WLCSP and BGA on circuit boards
  • Encapsulation for circuit board protection

3. Typical Properties

Uncured Properties

Property Value
Viscosity (mPa·s) @ 5 s⁻¹: 11,000
@ 50 s⁻¹: 2,100
Shelf Life (@ 5°C) 6 months

Curing Performance

Cure Type Condition Time
UV Cure Metal halide UV lamp (300 W/in, 4-inch distance)
Irradiance: 566 mW/cm²
5-25 sec
Moisture Cure Room temperature, 50% RH Cures ≥ 0.25 inch

Cured Properties

Property Initial (UV cure) +1 Day Moisture +2 Days Moisture +3 Days Moisture +4 Days Moisture +8 Days Moisture
Hardness (Shore D) 15 20 30 50 67 76
Property Value
CTE (ppm/°C) Below Tg: 81.5
Above Tg: 198
Glass Transition Temperature (Tg, °C) 75
Storage Modulus (N/mm² @ 25°C) 2,200 (319,000 psi)

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