LOCTITE® HHD 3542™ is a reactive polyurethane hotmelt adhesive designed for robotic dispensing. It has a long open time, solidifies quickly for good initial strength, and undergoes secondary moisture cure for enhanced durability. Once fully cured, it does not remelt.
| Property | Value |
|---|---|
| Uncured Properties | |
| Specific Gravity @ 25°C | 1.1 |
| Viscosity (Brookfield, 100°C) | 3,500 – 7,500 mPa.s |
| Flash Point | See SDS |
| Curing Characteristics | |
| Open Time @ 25°C (1mm bead) | < 4 minutes |
| Application Temperature | 90 – 110°C |
| Cured Properties | |
| Glass Transition Temperature (Tg) | -39°C |
| Coefficient of Thermal Expansion (Pre Tg) | 130 x 10⁻⁶ K⁻¹ |
| Coefficient of Thermal Expansion (Post Tg) | 340 x 10⁻⁶ K⁻¹ |
| Hardness (Shore D) | 30 |
| Thermal Conductivity | 0.21 W/(m.K) |
| Elongation at Break | 860% |
| Tensile Modulus | 91 N/mm² (13,225 psi) |
| Tensile Strength | >8 N/mm² (>1,225 psi) |
| Electrical Properties | |
| Dielectric Constant (1,000 KHz) | 3.48 |
| Test | Substrate | Strength (N/mm² / psi) |
|---|---|---|
| Lap Shear Strength | Anodized Aluminum | 7.2 / 1,045 |
| PC/ABS | 4.8 / 695 | |
| Cross Bond Tensile Loading Strength | Anodized Aluminum | 4.8 / 695 |
| PC/ABS | 5.8 / 840 |
| Condition | Aluminum (N/mm² / psi) | PC/ABS (N/mm² / psi) |
|---|---|---|
| 85°C / 85% RH (7 days) | 3.9 / 570 | 4.5 / 800 |
| Thermal Cycling | 7.2 / 1,040 | 6.4 / 935 |
| Heat Shock | 6.0 / 865 | 5.3 / 775 |
| Chemical Exposure | Retention of Strength (%) |
|---|---|
| Air (87°C, 500h/1000h) | 150 / 150 |
| Motor Oil (87°C, 500h/1000h) | 115 / 110 |
| Isopropanol (22°C, 500h/1000h) | 90 / 85 |
| Water (22°C, 500h/1000h) | 115 / 150 |
| Water/Glycol (87°C, 500h/1000h) | 130 / 140 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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