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LOCTITE® HHD 3612BK – Polyurethane Hot Melt Adhesive for Device Assembly, Gap Filling, Bonding

Item Name: LOCTITE® HHD 3612BK
Manufacturer: Henkel
Technologies: Polyurethane Hot Melt
Color: Black Solid
Cure Type: Solidification and Moisture
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

LOCTITE® HHD 3612BK is a black, one-component polyurethane hot-melt adhesive that cures through solidification and moisture. Designed for robotic jetting and automatic assembly lines, it provides fast initial strength and a secondary moisture cure that enhances elongation and structural durability. Once fully cured, the adhesive will not remelt.


2. Applications

  • Device assembly

  • Gap filling

  • Bonding

3. Typical Properties

Not Mixed / Uncured

Property Value
Technology Polyurethane Hot Melt
Appearance Black Solid
Components One part – no mixing required
Solids Content 100%
Viscosity (Brookfield, Thermosel, 110 °C, mPa·s) 4,500
Flash Point See SDS

Curing Performance / After Application

Property Value
Cure Mechanism Moisture
Open Time @ 25 °C ≥3 minutes
Preheating Schedule 20–30 minutes @ 110 °C
Application Temperature 100–120 °C
Handling Strength High immediately after bonding
Final Strength Development 1–7 days, depending on humidity, substrate moisture, permeability, and adhesive layer thickness

Cured Material Properties

Property Value
Transmittance (0.2 mm @ 550 nm) 0.15%
Elongation at Break 784%
Modulus 122 N/mm² (17,700 psi)
Cross Tensile Strength (2h, 25 °C, 60% RH) PBT/40% Glass: 1.5 N/mm² (218 psi)
AnAl: 2.0 N/mm² (290 psi)
Cross Tensile Strength (24h, 25 °C, 60% RH) PBT/40% Glass: 4.1 N/mm² (595 psi)
AnAl: 8.0 N/mm² (1,160 psi)
Lap Shear Strength (24h, 25 °C, 60% RH) PBT/40% Glass: 6.4 N/mm² (928 psi)
AnAl: 5.5 N/mm² (798 psi)

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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