• Item Name: LOCTITE® HHD 3616BK1
• Manufacturer: Henkel
• Technologies: Polyurethane Hot Melt
• Color: Black Solid
• Cure Type: Moisture
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
LOCTITE® HHD 3616BK1 is a black, odorless, one-part polyurethane hot-melt adhesive that cures via moisture. It is jet-dispensable and pressure-sensitive, providing high initial strength immediately after bonding. The adhesive is designed with a suitable open time for both manual and automatic assembly, offering excellent adhesion, impact resistance, reworkability, and reliable performance in electronic and structural applications.
Structural adhesive
Electronic structural bonding
Manual or automatic assembly line bonding
| Property | Uncured / Before Mixed | After Cured |
|---|---|---|
| Appearance | Black solid | – |
| Odor | Odorless | – |
| Technology | Polyurethane Hot Melt | – |
| Components | One part – requires no mixing | – |
| Viscosity (Brookfield, 110 °C, mPa·s) | 5,000 | – |
| Density @ 25 °C (g/cm³) | 1.1 | – |
| Solids Content (%) | 100 | – |
| Open Time @ 25 °C (minutes) | >4 | – |
| Preheating Schedule | 20–30 min @ 110 °C | – |
| Application Temperature (°C) | 100–130 | – |
| Elongation (%) | – | 607 |
| Modulus (N/mm²) | – | 82.4 |
| Tensile Strength (N/mm²) | – | 19 |
| Tensile Adhesion (N/mm²) | – | >8 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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